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  ly65542/l9 data sheet doc. no : qw0905- rev. : date : ligitek electronics co.,ltd. property of ligitek only rectangle type led lamps 19 - nov. - 2005 ly65542/l9 a
ligitek electronics co.,ltd. property of ligitek only package dimensions note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation + - 30 75% 25%50% -30 0 25% 50% 75% 0 -60 100% 60 100% 60.0min 2.54typ 1.0min 0.5 typ 2.0+0.05 -0.1 4.0 0.2 0.7max 1.0max part no. ly65542/l9 page 1/4 3.2+0.05 -0.1
-40 ~ +100 tstg storage temperature forward voltage @ ma(v) luminous intensity @10ma(mcd) 20 spectral halfwidth nm viewing angle 2 1/2 (deg) material peak wave length pnm part no gaasp/gap note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. ly65542/l9 20 typ. 585 white diffused yellow 1.7 352.68.0 emittedlensmin.max.min. 122 soldering temperature typical electrical & optical characteristics (ta=25 ) color tsol max 260 for 5 sec max (2mm from body) page2/4 part no. reverse current @5v operating temperature peak forward current duty 1/10@10khz absolute maximum ratings at ta=25 forward current power dissipation parameter 20 ma i f t opr ir -40 ~ +85 10 pd i fp 60 80 a ma mw symbol y ratings unit ligitek electronics co.,ltd. property of ligitek only ly65542/l9
3.0 2.5 1.5 1.0 0.5 0.0 2.0 fig.4 relative intensity vs. temperature 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 550 wavelength (nm) 500 0.0 0.5 600650700 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -40 0.8 -20 1.0 0.9 1.1 1.2 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 40 20 060100 80 ambient temperature( ) -40-20 02060 40100 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current typical electro-optical characteristics curve part no. 2.0 fig.1 forward current vs. forward voltage forward voltage(v) 100 f o r w a r d c u r r e n t ( m a ) 1.0 0.1 10 1.0 y chip 1000 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 3.04.05.0 3/4 page forward current(ma) 1.0101001000 ly65542/l9
ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hous. this test intended to see soldering well performed or not. ly65542/l9 part no. page 4/4


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